2025 OCP APAC Summit

2025 OCP APAC Summit

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9:00am PDT

Cooling Environments Overview

9:00am PDT

Introduction and Overview of Morning

9:00am PDT

OCP Open Systems for AI Overview

9:00am PDT

Advancing Data Center Innovation: Architectures Designed for Scalable Performance and Seamless Compatibility

9:00am PDT

Open Chiplet Economy: Bridging Taiwan and Silicon Valley

9:10am PDT

Super Fluid Technology Application in High Density Server Product

9:10am PDT

The Next Vector of Open Infrastructure Powering and Operationalizing AI Infra

9:10am PDT

Empowering the AI Era: The Evolution of Data Centers and Delta’s Strategic Response

9:25am PDT

Superfluid Technology: Redefining AI Cooling with Air-Infused Dielectric Fluids

9:30am PDT

Meeting AI Workload Demands with Arm CSA and Chiplet

9:30am PDT

Architecting Open-Scale Efficiency: A Modern OCP Server Blueprint from Design to Deployment

9:30am PDT

Exploring Azure's Advanced AI Infrastructure for secure and sustainable growth

9:30am PDT

Liteon Powering the Future: Scalable Solutions for AI GPU Infrastructure

9:40am PDT

Empowering Data Centers with Synthetic Ester Coolants: A New Era of Efficiency, Safety, and Sustainability

9:45am PDT

Innovations with Plug-and-Play Chiplets for Next Generation Computing using Universal Chiplet Interconnect Express (UCIe)

9:45am PDT

Low Carbon Emission Chassis Solution with Innovative Patterned Design

9:50am PDT

Catalina- Meta's Latest AI/ML System Overview

9:55am PDT

Chip to Data Thermal Resistance to Support 30°C Coolant

10:00am PDT

Integrated Photonics for Optical Interconnects

10:00am PDT

Super Computing and Status of High end computing in Nepal

10:10am PDT

Intel Super Fluid Technology Application in High Density Server Product

10:10am PDT

AI Computing Design Trends for LLMs in the Generative AI Era

10:10am PDT

Solid-State-Transformers for AI/ML Datacenter Power Infrastructure

10:15am PDT

Introduction to Co-Packaged Optics(CPO) - Architecture, Use Cases, and Operational, Software Implications

10:15am PDT

Advancing Edge-MHS Standardization : Edge Solution in 2U Chassis

10:30am PDT

Break

10:45am PDT

Role of Ethernet in the Next Generation AI System Architectures

10:45am PDT

Advanced Liquid Cooling Solutions

10:45am PDT

Requirements/Considerations of Next Generation ORv3 PSU and Power Shelves

10:45am PDT

Trending on Next Generation: Hardware Partitioning Boot with Assistant BMC

11:00am PDT

High LLM Density for Sustainable AI Computing Now and Coming Years

11:00am PDT

Energy Efficiency in Datacenter

11:00am PDT

Electromechanical Interconnect Solutions for Enabling High-Density AI/ML Racks with +/-400V DC Power

11:15am PDT

Extending the Frontier: Heterogeneous Integration of Chiplet Designs

11:15am PDT

Exhausted Heat Reuse by Free Cooling in IDC

11:15am PDT

Zero-Bias TLVR Exploration for Future Datacenter Computing Applications

11:15am PDT

Accelerating AI from Semiconductor to Data Center Infrastructure

11:30am PDT

Elastic Management Framework for the AI Cluster

11:30am PDT

Waste Heat Recovery and Reuse Opportunities

11:30am PDT

Advancing Data Center Performance: Design Considerations for Immersion Cooling of High-Speed Signals

11:30am PDT

Panel: Rack-Level Power Systems

11:45am PDT

AI Application Concepts and Hardware Optimization by Workload

11:45am PDT

Embracing AI: Infrastructure and Advanced Thermal Solutions

11:45am PDT

Thermal Design Considerations for High-Density DIMM System in Dual-Socket Datacenter Server Platforms

12:00pm PDT

Lunch Sponsored by ASE

1:00pm PDT

Introduction and Overview of Afternoon

1:00pm PDT

Technical Deep Dive of UEC 1.0

1:00pm PDT

AI-Driven Multiphysics Analysis for Silicon-to-System Advanced Packaging

1:00pm PDT

UQDv2 - Enabling Liquid at Scale

1:00pm PDT

OCP Modularity Standards (DC_MHS) - A Powerful Industry Inflection Point

1:10pm PDT

Beyond ORv3 HPR Busbars: Enabling Next Gen AI Rack Power Levels with Liquid Cooling

1:15pm PDT

UALink Overview

1:15pm PDT

AMD Advanced Packaging - Past, Present, and Future

1:15pm PDT

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

1:15pm PDT

Advanced Server Management on Arm to track: Latest Technological Advances in General Server Architecture

1:30pm PDT

Scale Up Ethernet Overview

1:30pm PDT

Enabling Scalable, Energy-Efficient Cooling with Two-Phase Sidecar Solutions

1:30pm PDT

Optimizing Bus Bar Systems for High-Current, High-Voltage AI/ML Power Distribution

1:45pm PDT

From Edge to Cloud: Custom ASIC Unleashing Datacenter AI Innovation

1:45pm PDT

The Cooling Solution for the Next Era: Advancements in Pumped Two-Phase Solutions

1:45pm PDT

The Evolution of Direct Liquid Cooling — From Single-phase to Two-phase

1:45pm PDT

APEC (Advanced PCIe Enclosure Compatible) for future HSIO interconnection

1:50pm PDT

Tray-Level 48V Two-Stage Power Delivery Challenges

2:00pm PDT

Strategic Innovations in Intel Server Design: Enhancing Compatibility and Performance in 19 inches High-Density Rack Server

2:10pm PDT

Requirements & Considerations of Next Gen ORv3/HVDC PSU’s and Power Shelves

2:15pm PDT

Chiplets Based HPC And AI Product Test Challenges

2:15pm PDT

CDU

2:15pm PDT

Deployment of an ORv3 Architecture Server Within Intel Open IP Single-Phase Immersion Cooling Tank

2:30pm PDT

Break

2:45pm PDT

Cooling Solutions for AI Racks and Clusters

2:45pm PDT

Lifecycle System Monitoring with Arm’s System Monitoring Control Framework (SMCF) and proteanTecs

2:45pm PDT

Overview of safety requirements for liquid cooling technologies

2:45pm PDT

Rack Architecture for Next Generation AI Server

2:45pm PDT

Scaling the Next Wave of Servers with PCIe Gen6

3:00pm PDT

Data Center Commissioning and Considerations for Direct Liquid Cooled Solutions

3:00pm PDT

ORV3 Rack Ship-loadable Packaging

3:00pm PDT

Panel: Architecting the Future: Server Design in the Age of AI

3:15pm PDT

Liquid Cooling Solutions for Large-Scale AI Clusters

3:15pm PDT

Corrosion Behavior of Brazed Heterogeneous Materials in Liquid Cooling Systems

3:15pm PDT

ORV3 Essential Accessories - 19” adapter, network cabling and airflow management

3:15pm PDT

Panel: Chiplet Technology in the AI Era: Opportunities and Challenges

3:30pm PDT

Innovative Liquid-Cooled Bus Bars: Enhancing Power Management in High-Density Data Centers

3:30pm PDT

Making the case for AI factories as a profit center

3:30pm PDT

Panel: Rack System Architectures

3:30pm PDT

Panel: Rack System Architectures

3:45pm PDT

Advancing the AI Factory by Doing More with More

3:45pm PDT

Predicting immersion fluid's stability window through accelerated aging model

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