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2025 OCP APAC Summit
2025 OCP APAC Summit
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Innovations with Plug-and-Play Chiplets for Next Generation Computing using Universal Chiplet Interconnect Express (UCIe)
Wednesday August 6, 2025 9:45am - 10:00am
PDT
TaiNEX2 - 701 F
Speakers
DD
Debendra Das Sharma
Intel
Wednesday August 6, 2025 9:45am - 10:00am
PDT
TaiNEX2 - 701 F
Chiplets & Advanced Packaging / Photonics
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