2025 OCP APAC Summit

2025 OCP APAC Summit

9:00am PDT

Keynotes TaiNEX 2 - 701 CD

12:00pm PDT

Lunch Sponsored by ASE Taipei Nangang Exhibition Center Hall 2

1:00pm PDT

Architecting the AI Fabric: Scalable Networking for Next-Generation AI Servers, Racks, and Clusters TaiNEX2 - 701 F Introduction of IOWN Global Forum TaiNEX 2 - 701 E Opening Track Overview / APAC Based Project TaiNEX2 - 701 G

1:20pm PDT

Revisit RoCEv2 issues in large scale deployment and the future that UEC promise TaiNEX2 - 701 F Introduction to OCP for (new) IOWN audience TaiNEX 2 - 701 E

1:40pm PDT

Enhancing Financial Intercommunication through IOWN/APN: The Future of Data Center Connectivity TaiNEX 2 - 701 E Evolving FBOSS to support Generative AI network workloads TaiNEX2 - 701 F Use Cases for CXL RAS Firmware-First Error Handling TaiNEX2 - 701 G

1:55pm PDT

World first international APN and RDMA-over-APN evaluation TaiNEX 2 - 701 E

2:00pm PDT

New paradigm for lossless DCI interconnect in the AI/ML era TaiNEX2 - 701 F

2:10pm PDT

APN-T 400G Muxponder for Cloud Edge Computing TaiNEX 2 - 701 E

2:20pm PDT

Dynamic ECN Threshold Testing Methodology and the Importance of qp-fairness TaiNEX2 - 701 F Architecting AI Storage: A Strategy for High-Performance and Tenant Object Storage TaiNEX2 - 701 G

2:25pm PDT

Operational challenges for realizing a multi-vendor CDI configuration TaiNEX 2 - 701 E

2:35pm PDT

Fast and Accurate Heat Dispersion Modeling for Data Centers TaiNEX2 - 703

2:40pm PDT

Tenant Aware VM and Container Integrated Layer 2 Networks TaiNEX 2 - 701 E e-Tube Technology - Breaking Interconnect Barriers To Accelerate AI Cluster Scale Up TaiNEX2 - 701 F

3:00pm PDT

Break Taipei Nangang Exhibition Center Hall 2

3:15pm PDT

Remote GPU over APN/Confidential computing TaiNEX 2 - 701 E NVMe TaiNEX2 - 701 G Advancements in 400G/Lane SerDes for High-Speed AI Connectivity TaiNEX2 - 703 End-to-End Observability Across Network and Compute Layers for AI Workload Optimization TaiNEX2 - 701 F

3:30pm PDT

Ideal AI/ML optical interconnect solution for sustainable data centers TaiNEX 2 - 701 E

3:40pm PDT

Pioneering AI Cooling: High Power Cold Plates with 200W/cm² Heat Flux for Next-Gen AI ASICs TaiNEX2 - 703

3:45pm PDT

KV Cache Sharing over IOWN APN: Building a Sustainable and High-Performance Nation-Wide Distributed AI for LLM Inference TaiNEX 2 - 701 E Proactive Link Management in AI Networks: Lessons from Meta TaiNEX2 - 701 F

3:55pm PDT

OCP Composable Security Architecture: Adoption @ AMD OCP Lock TaiNEX2 - 701 G

4:00pm PDT

Towards Energy-Efficient AI Infrastructure through the Integration of Computing and Networking TaiNEX 2 - 701 E

4:05pm PDT

Adaptive Multi-Tenant Orchestration of AI Fabric TaiNEX2 - 701 F Thermal-Safe Operation for GPU Under Power Constraints Using Reinforcement Learning TaiNEX2 - 703

4:15pm PDT

Optical circuit switching technology for future AI clusters TaiNEX 2 - 701 E Unlocking Next-Generation Data Center Performance: Leveraging CXL Memory for Scalable AI and Database Workloads TaiNEX2 - 701 G

4:25pm PDT

Scale-up AI Networking Alternatives - Comparing UALink, SUE and NVLink TaiNEX2 - 701 F

4:30pm PDT

Reference Implementation of an SDN Controller for Open Optical-circuit-switched AI Clusters TaiNEX 2 - 701 E Tensor Contraction as a First-Class Primitive: Learnings from Building Efficient and Programmable AI Compute TaiNEX2 - 703

4:35pm PDT

Cooling Presentation TaiNEX2 - 701 G

4:45pm PDT

State of the Debate: Pluggable, Linear vs Copackaged Optics TaiNEX 2 - 701 E

5:00pm PDT

Welcome Reception Sponsored by Meta Taipei Nangang Exhibition Center Hall 2

9:00am PDT

Cooling Environments Overview TaiNEX2 - 701 H Introduction and Overview of Morning TaiNEX2 - 701 G OCP Open Systems for AI Overview TaiNEX 2 - 701 E Advancing Data Center Innovation: Architectures Designed for Scalable Performance and Seamless Compatibility TaiNEX2 - 703 Open Chiplet Economy: Bridging Taiwan and Silicon Valley TaiNEX2 - 701 F

9:10am PDT

Super Fluid Technology Application in High Density Server Product TaiNEX2 - 701 H Empowering the AI Era: The Evolution of Data Centers and Delta’s Strategic Response TaiNEX2 - 701 G

9:25am PDT

Superfluid Technology: Redefining AI Cooling with Air-Infused Dielectric Fluids TaiNEX2 - 701 H

9:30am PDT

Meeting AI Workload Demands with Arm CSA and Chiplet TaiNEX2 - 701 F Architecting Open-Scale Efficiency: A Modern OCP Server Blueprint from Design to Deployment TaiNEX2 - 703 Exploring Azure's Advanced AI Infrastructure for secure and sustainable growth TaiNEX 2 - 701 E Liteon Powering the Future: Scalable Solutions for AI GPU Infrastructure TaiNEX2 - 701 G

9:40am PDT

Empowering Data Centers with Synthetic Ester Coolants: A New Era of Efficiency, Safety, and Sustainability TaiNEX2 - 701 H

9:45am PDT

Innovations with Plug-and-Play Chiplets for Next Generation Computing using Universal Chiplet Interconnect Express (UCIe) TaiNEX2 - 701 F

9:50am PDT

Catalina- Meta's Latest AI/ML System Overview TaiNEX 2 - 701 E

9:55am PDT

Chip to Data Thermal Resistance to Support 30°C Coolant TaiNEX2 - 701 H

10:00am PDT

Integrated Photonics for Optical Interconnects TaiNEX2 - 701 F Low Carbon Emission Chassis Solution with Innovative Patterned Design TaiNEX2 - 703

10:10am PDT

Intel Super Fluid Technology Application in High Density Server Product TaiNEX2 - 701 H AI Computing Design Trends for LLMs in the Generative AI Era TaiNEX 2 - 701 E

10:15am PDT

Introduction to Co-Packaged Optics(CPO) - Architecture, Use Cases, and Operational, Software Implications TaiNEX2 - 701 F Super Computing and Status of High end computing in Nepal TaiNEX2 - 703

10:30am PDT

Break Taipei Nangang Exhibition Center Hall 2

10:45am PDT

Role of Ethernet in the Next Generation AI System Architectures TaiNEX 2 - 701 E Advanced Liquid Cooling Solutions TaiNEX2 - 701 H Requirements/Considerations of Next Generation ORv3 PSU and Power Shelves TaiNEX2 - 701 G Accelerating AI from Semiconductor to Data Center Infrastructure TaiNEX2 - 703

11:00am PDT

High LLM Density for Sustainable AI Computing Now and Coming Years TaiNEX 2 - 701 E Energy Efficiency in Datacenter TaiNEX2 - 701 H Electromechanical Interconnect Solutions for Enabling High-Density AI/ML Racks with +/-400V DC Power TaiNEX2 - 701 G Trending on Next Generation: Hardware Partitioning Boot with Assistant BMC TaiNEX2 - 703

11:15am PDT

Extending the Frontier: Heterogeneous Integration of Chiplet Designs TaiNEX2 - 701 F Exhausted Heat Reuse by Free Cooling in IDC TaiNEX2 - 701 H Zero-Bias TLVR Exploration for Future Datacenter Computing Applications TaiNEX2 - 701 G Advancing Data Center Performance: Design Considerations for Immersion Cooling of High-Speed Signals TaiNEX2 - 703

11:30am PDT

Elastic Management Framework for the AI Cluster TaiNEX 2 - 701 E Waste Heat Recovery and Reuse Opportunities TaiNEX2 - 701 H Advancing Edge-MHS Standardization : Edge Solution in 2U Chassis TaiNEX2 - 703 Rack-Level Power Systems TaiNEX2 - 701 G

11:45am PDT

AI Application Concepts and Hardware Optimization by Workload TaiNEX 2 - 701 E Embracing AI: Infrastructure and Advanced Thermal Solutions TaiNEX2 - 701 H Thermal Design Considerations for High-Density DIMM System in Dual-Socket Datacenter Server Platforms TaiNEX2 - 703

12:00pm PDT

Lunch Sponsored by ASE Taipei Nangang Exhibition Center Hall 2

1:00pm PDT

Introduction and Overview of Afternoon TaiNEX2 - 701 G Technical Deep Dive of UEC 1.0 TaiNEX 2 - 701 E AI-Driven Multiphysics Analysis for Silicon-to-System Advanced Packaging TaiNEX2 - 701 F UQDv2 - Enabling Liquid at Scale TaiNEX2 - 701 H OCP Modularity Standards (DC_MHS) - A Powerful Industry Inflection Point TaiNEX2 - 703

1:10pm PDT

Beyond ORv3 HPR Busbars: Enabling Next Gen AI Rack Power Levels with Liquid Cooling TaiNEX2 - 701 G

1:15pm PDT

UALink Overview TaiNEX 2 - 701 E AMD Advanced Packaging - Past, Present, and Future TaiNEX2 - 701 F Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach TaiNEX2 - 701 H Advanced Server Management on Arm to track: Latest Technological Advances in General Server Architecture TaiNEX2 - 703

1:30pm PDT

Scale Up Ethernet Overview TaiNEX 2 - 701 E Enabling Scalable, Energy-Efficient Cooling with Two-Phase Sidecar Solutions TaiNEX2 - 701 H Optimizing Bus Bar Systems for High-Current, High-Voltage AI/ML Power Distribution TaiNEX2 - 701 G

1:45pm PDT

The Cooling Solution for the Next Era: Advancements in Pumped Two-Phase Solutions TaiNEX2 - 701 H The Evolution of Direct Liquid Cooling — From Single-phase to Two-phase TaiNEX2 - 701 H APEC (Advanced PCIe Enclosure Compatible) for future HSIO interconnection TaiNEX2 - 703

1:50pm PDT

Tray-Level 48V Two-Stage Power Delivery Challenges TaiNEX2 - 701 G

2:00pm PDT

From Edge to Cloud: Custom ASIC Unleashing Datacenter AI Innovation TaiNEX2 - 701 F Strategic Innovations in Intel Server Design: Enhancing Compatibility and Performance in 19 inches High-Density Rack Server TaiNEX2 - 703 Panel: Scale-up Ecosystem Discussion TaiNEX 2 - 701 E

2:15pm PDT

CDU TaiNEX2 - 701 H Deployment of an ORv3 Architecture Server Within Intel Open IP Single-Phase Immersion Cooling Tank TaiNEX2 - 703

2:30pm PDT

Chiplets Based HPC And AI Product Test Challenges TaiNEX2 - 701 F Break Taipei Nangang Exhibition Center Hall 2

2:45pm PDT

Cooling Solutions for AI Racks and Clusters TaiNEX 2 - 701 E Lifecycle System Monitoring with Arm’s System Monitoring Control Framework (SMCF) and proteanTecs TaiNEX2 - 701 F Overview of safety requirements for liquid cooling technologies TaiNEX2 - 701 H Rack Architecture for Next Generation AI Server TaiNEX2 - 701 G Scaling the Next Wave of Servers with PCIe Gen6 TaiNEX2 - 703

3:00pm PDT

Data Center Commissioning and Considerations for Direct Liquid Cooled Solutions TaiNEX2 - 701 H ORV3 rack Ship-loadable Packaging TaiNEX2 - 701 G Panel: Chiplet Technology in the AI Era: Opportunities and Challenges TaiNEX2 - 701 F

3:15pm PDT

Liquid Cooling Solutions for Large-Scale AI Clusters TaiNEX 2 - 701 E Corrosion Behavior of Brazed Heterogeneous Materials in Liquid Cooling Systems TaiNEX2 - 701 H ORV3 essential accessories - 19” adapter, network cabling and airflow management TaiNEX2 - 701 G

3:30pm PDT

Innovative Liquid-Cooled Bus Bars: Enhancing Power Management in High-Density Data Centers TaiNEX 2 - 701 E Making the case for AI factories as a profit center TaiNEX2 - 701 H

3:45pm PDT

Advancing the AI Factory by Doing More with More TaiNEX 2 - 701 E Predicting immersion fluid's stability window through accelerated aging model TaiNEX2 - 701 H

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