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2025 OCP APAC Summit
Wednesday August 6, 2025 9:55am - 10:10am PDT
Data center operators and silicon providers are aligning on a durable coolant temperature. of 30℃ to meet long-term roadmaps. There is also interest in supporting higher coolant temperatures for heat reuse and lower temperatures for extreme density required for AI workloads. To understand coolant temperature requirements, thermal resistance from silicon to the environment will be discussed. In addition, areas of thermal performance be investigated by the industry will be reviewed.
Speakers
PA

Paul Artman

Fellow System Design, AMD
Wednesday August 6, 2025 9:55am - 10:10am PDT
TaiNEX2 - 701 H

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