With the rise of AI computing, traditional air cooling methods are no longer sufficient to handle the thermal challenges in high-performance computing (HPC) systems. Liquid cooling has emerged as a reliable and efficient alternative to dissipate heat at kilowatt levels. In this presentation, we will introduce the liquid cooling technologies developed by TAIWAN MICROLOOPS, including the Cooling Distribution Unit (CDU) and various types of cold plates. Standard and customized CDUs are designed to meet refrigeration capacity demands ranging from several kilowatts to hundreds of kilowatts. We will also demonstrate both single-phase and two-phase cold plates. These solutions are designed to enhance thermal management efficiency and meet the increasing demands of AI-driven data centers.
