The rapid growth of AI chips has increased computational demands, and future high-performance computing (HPC) systems are expected to integrate multiple high-power chips, resulting in total power consumption of over 2.5kW and individual chip power densities exceeding 200W/cm². To tackle these challenges, advanced cooling technologies are essential to lower thermal resistance and efficiently dissipate heat. In this paper, we explore innovative structural designs for cold plates that address critical thermal management challenges for next-generation AI systems, as well as the corresponding thermal test vehicle that can generate different power densities.
