2025 OCP APAC Summit

The shift to +/-400V DC power systems is crucial to meet the rising power demands of AI/ML applications, supporting rack densities of >140 kW. This transition introduces significant challenges for power distribution within datacenters. Critical components like bus bars, connectors, and cables must meet stringent requirements for power handling, thermal management, reliability, safety, and density. This paper explores design solutions for electromechanical interconnects in these high-power environments, drawing parallels with mature ecosystems in industries like Electric Vehicles. Innovative approaches to bus bar design and connector technology offer the performance and space savings needed for next-gen AI/ML infrastructure. The discussion addresses crucial safety aspects, including arc flash mitigation, insulation systems, and touch-safe designs. By overcoming these challenges, the industry can accelerate the transition to higher voltages, unlocking AI/ML platforms' full potential.