As AI workloads push rack power demands well beyond the ~30 kW limits of Open Rack v3, the industry has defined a High-Power Rack (HPR) standard that delivers over 200 kW per rack. This talk explains how liquid-cooled vertical busbars integrate coolant channels around copper conductors to dramatically improve heat removal and reduce I²R losses, all while fitting into existing ORv3 form factors. It also covers modular power-whip assemblies for simplified maintenance, upgraded high-voltage PSUs and battery backup units for resilience, and how OCP member companies collaborate on safety, interoperability, and scalability. Together, these innovations form an end-to-end ecosystem enabling next-generation AI data centers to meet extreme power, thermal, and reliability requirements.
Wednesday August 6, 2025 1:10pm - 1:30pm PDT TaiNEX2 - 701 G