2025 OCP APAC Summit

As AI and ML power demands increase, driving rack power levels to 140 kW and necessitating higher voltages like +/-400V DC, optimizing bus bar systems becomes crucial for efficient, reliable power delivery. Bus bars, ideal for high-current applications, face unique challenges in high-density AI/ML racks, including thermal management, space optimization, structural rigidity, and safety. This paper explores advanced design techniques for future AI/ML power architectures, covering material selection (e.g., copper, aluminum), cross-section optimization, insulation strategies, and terminal methods. Thermal and mechanical simulations ensure performance and durability. Critical safety features, such as touch protection and creepage distances, are integrated. These solutions aim to develop robust power infrastructure for next-gen AI/ML data centers.