This session delves into the critical design considerations and emerging challenges associated with immersion cooling for high-speed signals in data centers. Key topics include the electrical characterization of cooling liquids, the performance benefits of improved thermal environments, and the impact of immersion fluids on high-speed interconnects—from individual components to entire signal channels. The discussion also covers design optimization strategies tailored for submerged environments. Finally, the session highlights the current state of industry readiness and the technical hurdles that must be addressed to ensure reliable high-speed signaling under immersion cooling conditions.
