As memory capacity and bandwidth demands continue to rise, system designs are pushing toward higher memory density—particularly in dual-socket server platforms. This session will explore the thermal design challenges and considerations involved in supporting a 2-socket, 32-DIMM configuration on the latest Intel® Xeon® platform within a standard 19-inch rack chassis. In such configurations, DIMM pitch is constrained to 0.25"–0.27", significantly increasing the complexity of memory cooling. We will present thermal evaluation results based on Intel-developed CPU and DDR5 Thermal Test Vehicles (TTVs), which simulate real-world heat profiles and airflow interactions.
