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2025 OCP APAC Summit
Wednesday August 6, 2025 2:45pm - 3:00pm PDT
According to the development trend of power consumption and heat dissipation in the general sever and AI server, the evolution of cooling solutions has changed from air cooling to hybrid cooling, then to full liquid cooling. In response to this development trend, we proposed an integrated liquid cooling solution for the building blocks of the AI clusters, including the AI IT rack, High Power Cabinet, and the Cooling Cabinet.
Speakers
CP

Chris Pai

Engineering VP, Foxconn/Ingrasys
Wednesday August 6, 2025 2:45pm - 3:00pm PDT
TaiNEX 2 - 701 E

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