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2025 OCP APAC Summit
Wednesday August 6, 2025 2:10pm - 2:30pm PDT
In this presentation, we will look at the requirements of next generation higher power ORv3 power supplies and HVDC power shelves, which will help increase rack payload and power density yet again, while supporting key design requirements ranging from hot swapability to battery backup. Among the topics covered during the session will be an update on key design specifications and design considerations, as well as the most recent ORv3 technologies – including power supplies, power shelves, shelf controllers and battery backup solutions.
We will also explore the next Generation Rack and Power roadmaps.
Speakers
Wednesday August 6, 2025 2:10pm - 2:30pm PDT
TaiNEX2 - 701 G

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