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2025 OCP APAC Summit
2025 OCP APAC Summit
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CP
Chris Pai
Foxconn/Ingrasys
Engineering VP
My Speakers Sessions
Wednesday
, August 6
2:45pm
PDT
Cooling Solutions for AI Racks and Clusters
TaiNEX 2 - 701 E
Rack Architecture for Next Generation AI Server
TaiNEX2 - 701 G
3:30pm
PDT
Panel: Rack System Architectures
TaiNEX2 - 701 G
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