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2025 OCP APAC Summit
2025 OCP APAC Summit
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JH
Jake Hsieh
Wiwynn
Thermal Engineer
My Speakers Sessions
Tuesday
, August 5
3:40pm
PDT
Pioneering AI Cooling: High Power Cold Plates with 200W/cm² Heat Flux for Next-Gen AI ASICs
TaiNEX2 - 703
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