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2025 OCP APAC Summit
2025 OCP APAC Summit
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Tuesday
, August 5
TaiNEX 2 - 701 CD
9:00am •
Keynotes
TaiNEX 2 - 701 E
1:00pm •
Introduction of IOWN Global Forum
1:20pm •
Introduction to OCP for (new) IOWN audience
1:40pm •
Enhancing Financial Intercommunication through IOWN/APN: The Future of Data Center Connectivity
1:55pm •
World first international APN and RDMA-over-APN evaluation
2:10pm •
APN-T 400G Muxponder for Cloud Edge Computing
2:25pm •
Operational challenges for realizing a multi-vendor CDI configuration
2:40pm •
Tenant Aware VM and Container Integrated Layer 2 Networks
3:15pm •
Remote GPU over APN/Confidential computing
3:30pm •
Ideal AI/ML optical interconnect solution for sustainable data centers
3:45pm •
KV Cache Sharing over IOWN APN: Building a Sustainable and High-Performance Nation-Wide Distributed AI for LLM Inference
4:00pm •
Towards Energy-Efficient AI Infrastructure through the Integration of Computing and Networking
4:15pm •
Optical circuit switching technology for future AI clusters
4:30pm •
Reference Implementation of an SDN Controller for Open Optical-circuit-switched AI Clusters
4:45pm •
State of the Debate: Pluggable, Linear vs Copackaged Optics
TaiNEX2 - 701 F
1:00pm •
Architecting the AI Fabric: Scalable Networking for Next-Generation AI Servers, Racks, and Clusters
1:20pm •
Revisit RoCEv2 issues in large scale deployment and the future that UEC promise
1:40pm •
Evolving FBOSS to support Generative AI network workloads
2:00pm •
New paradigm for lossless DCI interconnect in the AI/ML era
2:20pm •
Dynamic ECN Threshold Testing Methodology and the Importance of qp-fairness
2:40pm •
e-Tube Technology - Breaking Interconnect Barriers To Accelerate AI Cluster Scale Up
3:15pm •
End-to-End Observability Across Network and Compute Layers for AI Workload Optimization
3:45pm •
Proactive Link Management in AI Networks: Lessons from Meta
4:05pm •
Adaptive Multi-Tenant Orchestration of AI Fabric
4:25pm •
Scale-up AI Networking Alternatives - Comparing UALink, SUE and NVLink
TaiNEX2 - 701 G
1:00pm •
Opening Track Overview / APAC Based Project
1:40pm •
Use Cases for CXL RAS Firmware-First Error Handling
2:20pm •
Architecting AI Storage: A Strategy for High-Performance and Tenant Object Storage
3:15pm •
NVMe
3:55pm •
OCP Composable Security Architecture: Adoption @ AMD OCP Lock
4:15pm •
Unlocking Next-Generation Data Center Performance: Leveraging CXL Memory for Scalable AI and Database Workloads
4:35pm •
Cooling Presentation
TaiNEX2 - 703
2:35pm •
Fast and Accurate Heat Dispersion Modeling for Data Centers
3:15pm •
Advancements in 400G/Lane SerDes for High-Speed AI Connectivity
3:40pm •
Pioneering AI Cooling: High Power Cold Plates with 200W/cm² Heat Flux for Next-Gen AI ASICs
4:05pm •
Thermal-Safe Operation for GPU Under Power Constraints Using Reinforcement Learning
4:30pm •
Tensor Contraction as a First-Class Primitive: Learnings from Building Efficient and Programmable AI Compute
Taipei Nangang Exhibition Center Hall 2
12:00pm •
Lunch Sponsored by ASE
3:00pm •
Break
5:00pm •
Welcome Reception Sponsored by Meta
Wednesday
, August 6
TaiNEX 2 - 701 E
9:00am •
OCP Open Systems for AI Overview
9:30am •
Exploring Azure's Advanced AI Infrastructure for secure and sustainable growth
9:50am •
Catalina- Meta's Latest AI/ML System Overview
10:10am •
AI Computing Design Trends for LLMs in the Generative AI Era
10:45am •
Role of Ethernet in the Next Generation AI System Architectures
11:00am •
High LLM Density for Sustainable AI Computing Now and Coming Years
11:30am •
Elastic Management Framework for the AI Cluster
11:45am •
AI Application Concepts and Hardware Optimization by Workload
1:00pm •
Technical Deep Dive of UEC 1.0
1:15pm •
UALink Overview
1:30pm •
Scale Up Ethernet Overview
2:00pm •
Panel: Scale-up Ecosystem Discussion
2:45pm •
Cooling Solutions for AI Racks and Clusters
3:15pm •
Liquid Cooling Solutions for Large-Scale AI Clusters
3:30pm •
Innovative Liquid-Cooled Bus Bars: Enhancing Power Management in High-Density Data Centers
3:45pm •
Advancing the AI Factory by Doing More with More
TaiNEX2 - 701 F
9:00am •
Open Chiplet Economy: Bridging Taiwan and Silicon Valley
9:30am •
Meeting AI Workload Demands with Arm CSA and Chiplet
9:45am •
Innovations with Plug-and-Play Chiplets for Next Generation Computing using Universal Chiplet Interconnect Express (UCIe)
10:00am •
Integrated Photonics for Optical Interconnects
10:15am •
Introduction to Co-Packaged Optics(CPO) - Architecture, Use Cases, and Operational, Software Implications
11:15am •
Extending the Frontier: Heterogeneous Integration of Chiplet Designs
1:00pm •
AI-Driven Multiphysics Analysis for Silicon-to-System Advanced Packaging
1:15pm •
AMD Advanced Packaging - Past, Present, and Future
2:00pm •
From Edge to Cloud: Custom ASIC Unleashing Datacenter AI Innovation
2:30pm •
Chiplets Based HPC And AI Product Test Challenges
2:45pm •
Lifecycle System Monitoring with Arm’s System Monitoring Control Framework (SMCF) and proteanTecs
3:00pm •
Panel: Chiplet Technology in the AI Era: Opportunities and Challenges
TaiNEX2 - 701 G
9:00am •
Introduction and Overview of Morning
9:10am •
Empowering the AI Era: The Evolution of Data Centers and Delta’s Strategic Response
9:30am •
Liteon Powering the Future: Scalable Solutions for AI GPU Infrastructure
10:45am •
Requirements/Considerations of Next Generation ORv3 PSU and Power Shelves
11:00am •
Electromechanical Interconnect Solutions for Enabling High-Density AI/ML Racks with +/-400V DC Power
11:15am •
Zero-Bias TLVR Exploration for Future Datacenter Computing Applications
11:30am •
Rack-Level Power Systems
1:00pm •
Introduction and Overview of Afternoon
1:10pm •
Beyond ORv3 HPR Busbars: Enabling Next Gen AI Rack Power Levels with Liquid Cooling
1:30pm •
Optimizing Bus Bar Systems for High-Current, High-Voltage AI/ML Power Distribution
1:50pm •
Tray-Level 48V Two-Stage Power Delivery Challenges
2:45pm •
Rack Architecture for Next Generation AI Server
3:00pm •
ORV3 rack Ship-loadable Packaging
3:15pm •
ORV3 essential accessories - 19” adapter, network cabling and airflow management
TaiNEX2 - 701 H
9:00am •
Cooling Environments Overview
9:10am •
Super Fluid Technology Application in High Density Server Product
9:25am •
Superfluid Technology: Redefining AI Cooling with Air-Infused Dielectric Fluids
9:40am •
Empowering Data Centers with Synthetic Ester Coolants: A New Era of Efficiency, Safety, and Sustainability
9:55am •
Chip to Data Thermal Resistance to Support 30°C Coolant
10:10am •
Intel Super Fluid Technology Application in High Density Server Product
10:45am •
Advanced Liquid Cooling Solutions
11:00am •
Energy Efficiency in Datacenter
11:15am •
Exhausted Heat Reuse by Free Cooling in IDC
11:30am •
Waste Heat Recovery and Reuse Opportunities
11:45am •
Embracing AI: Infrastructure and Advanced Thermal Solutions
1:00pm •
UQDv2 - Enabling Liquid at Scale
1:15pm •
Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach
1:30pm •
Enabling Scalable, Energy-Efficient Cooling with Two-Phase Sidecar Solutions
1:45pm •
The Cooling Solution for the Next Era: Advancements in Pumped Two-Phase Solutions
1:45pm •
The Evolution of Direct Liquid Cooling — From Single-phase to Two-phase
2:15pm •
CDU
2:45pm •
Overview of safety requirements for liquid cooling technologies
3:00pm •
Data Center Commissioning and Considerations for Direct Liquid Cooled Solutions
3:15pm •
Corrosion Behavior of Brazed Heterogeneous Materials in Liquid Cooling Systems
3:30pm •
Making the case for AI factories as a profit center
3:45pm •
Predicting immersion fluid's stability window through accelerated aging model
TaiNEX2 - 703
9:00am •
Advancing Data Center Innovation: Architectures Designed for Scalable Performance and Seamless Compatibility
9:30am •
Architecting Open-Scale Efficiency: A Modern OCP Server Blueprint from Design to Deployment
10:00am •
Low Carbon Emission Chassis Solution with Innovative Patterned Design
10:15am •
Super Computing and Status of High end computing in Nepal
10:45am •
Accelerating AI from Semiconductor to Data Center Infrastructure
11:00am •
Trending on Next Generation: Hardware Partitioning Boot with Assistant BMC
11:15am •
Advancing Data Center Performance: Design Considerations for Immersion Cooling of High-Speed Signals
11:30am •
Advancing Edge-MHS Standardization : Edge Solution in 2U Chassis
11:45am •
Thermal Design Considerations for High-Density DIMM System in Dual-Socket Datacenter Server Platforms
1:00pm •
OCP Modularity Standards (DC_MHS) - A Powerful Industry Inflection Point
1:15pm •
Advanced Server Management on Arm to track: Latest Technological Advances in General Server Architecture
1:45pm •
APEC (Advanced PCIe Enclosure Compatible) for future HSIO interconnection
2:00pm •
Strategic Innovations in Intel Server Design: Enhancing Compatibility and Performance in 19 inches High-Density Rack Server
2:15pm •
Deployment of an ORv3 Architecture Server Within Intel Open IP Single-Phase Immersion Cooling Tank
2:45pm •
Scaling the Next Wave of Servers with PCIe Gen6
Taipei Nangang Exhibition Center Hall 2
10:30am •
Break
12:00pm •
Lunch Sponsored by ASE
2:30pm •
Break
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Tuesday
, August 5
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, August 6
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AI Clusters
Chiplets & Advanced Packaging / Photonics
Cooling Environments
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