2025 OCP APAC Summit

2025 OCP APAC Summit

9:00am PDT

Cooling Environments Overview TaiNEX2 - 701 H

9:10am PDT

Super Fluid Technology Application in High Density Server Product TaiNEX2 - 701 H

9:25am PDT

Superfluid Technology: Redefining AI Cooling with Air-Infused Dielectric Fluids TaiNEX2 - 701 H

9:40am PDT

Empowering Data Centers with Synthetic Ester Coolants: A New Era of Efficiency, Safety, and Sustainability TaiNEX2 - 701 H

9:55am PDT

Chip to Data Thermal Resistance to Support 30°C Coolant TaiNEX2 - 701 H

10:10am PDT

Intel Super Fluid Technology Application in High Density Server Product TaiNEX2 - 701 H

10:45am PDT

Advanced Liquid Cooling Solutions TaiNEX2 - 701 H

11:00am PDT

Energy Efficiency in Datacenter TaiNEX2 - 701 H

11:15am PDT

Exhausted Heat Reuse by Free Cooling in IDC TaiNEX2 - 701 H

11:30am PDT

Waste Heat Recovery and Reuse Opportunities TaiNEX2 - 701 H

11:45am PDT

Embracing AI: Infrastructure and Advanced Thermal Solutions TaiNEX2 - 701 H

1:00pm PDT

UQDv2 - Enabling Liquid at Scale TaiNEX2 - 701 H

1:15pm PDT

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach TaiNEX2 - 701 H

1:30pm PDT

Enabling Scalable, Energy-Efficient Cooling with Two-Phase Sidecar Solutions TaiNEX2 - 701 H

1:45pm PDT

The Cooling Solution for the Next Era: Advancements in Pumped Two-Phase Solutions TaiNEX2 - 701 H The Evolution of Direct Liquid Cooling — From Single-phase to Two-phase TaiNEX2 - 701 H

2:15pm PDT

CDU TaiNEX2 - 701 H

2:45pm PDT

Overview of safety requirements for liquid cooling technologies TaiNEX2 - 701 H

3:00pm PDT

Data Center Commissioning and Considerations for Direct Liquid Cooled Solutions TaiNEX2 - 701 H

3:15pm PDT

Corrosion Behavior of Brazed Heterogeneous Materials in Liquid Cooling Systems TaiNEX2 - 701 H

3:30pm PDT

Making the case for AI factories as a profit center TaiNEX2 - 701 H

3:45pm PDT

Predicting immersion fluid's stability window through accelerated aging model TaiNEX2 - 701 H

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