2025 OCP APAC Summit

2025 OCP APAC Summit

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9:00am PDT

Introduction and Overview of Morning TaiNEX2 - 701 G

9:10am PDT

Empowering the AI Era: The Evolution of Data Centers and Delta’s Strategic Response TaiNEX2 - 701 G

9:30am PDT

Liteon Powering the Future: Scalable Solutions for AI GPU Infrastructure TaiNEX2 - 701 G

10:10am PDT

Solid-State-Transformers for AI/ML Datacenter Power Infrastructure TaiNEX2 - 701 G

10:45am PDT

Requirements/Considerations of Next Generation ORv3 PSU and Power Shelves TaiNEX2 - 701 G

11:00am PDT

Electromechanical Interconnect Solutions for Enabling High-Density AI/ML Racks with +/-400V DC Power TaiNEX2 - 701 G

11:15am PDT

Zero-Bias TLVR Exploration for Future Datacenter Computing Applications TaiNEX2 - 701 G

11:30am PDT

Panel: Rack-Level Power Systems TaiNEX2 - 701 G

1:00pm PDT

Introduction and Overview of Afternoon TaiNEX2 - 701 G

1:10pm PDT

Beyond ORv3 HPR Busbars: Enabling Next Gen AI Rack Power Levels with Liquid Cooling TaiNEX2 - 701 G

1:30pm PDT

Optimizing Bus Bar Systems for High-Current, High-Voltage AI/ML Power Distribution TaiNEX2 - 701 G

1:50pm PDT

Tray-Level 48V Two-Stage Power Delivery Challenges TaiNEX2 - 701 G

2:10pm PDT

Requirements & Considerations of Next Gen ORv3/HVDC PSU’s and Power Shelves TaiNEX2 - 701 G

2:45pm PDT

Rack Architecture for Next Generation AI Server TaiNEX2 - 701 G

3:00pm PDT

ORV3 Rack Ship-loadable Packaging TaiNEX2 - 701 G

3:15pm PDT

ORV3 Essential Accessories - 19” adapter, network cabling and airflow management TaiNEX2 - 701 G

3:30pm PDT

Panel: Rack System Architectures TaiNEX2 - 701 G Panel: Rack System Architectures TaiNEX2 - 701 G

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