2025 OCP APAC Summit

2025 OCP APAC Summit

9:00am PDT

Open Chiplet Economy: Bridging Taiwan and Silicon Valley TaiNEX2 - 701 F

9:30am PDT

Meeting AI Workload Demands with Arm CSA and Chiplet TaiNEX2 - 701 F

9:45am PDT

Innovations with Plug-and-Play Chiplets for Next Generation Computing using Universal Chiplet Interconnect Express (UCIe) TaiNEX2 - 701 F

10:00am PDT

Integrated Photonics for Optical Interconnects TaiNEX2 - 701 F

10:15am PDT

Introduction to Co-Packaged Optics(CPO) - Architecture, Use Cases, and Operational, Software Implications TaiNEX2 - 701 F

11:15am PDT

Extending the Frontier: Heterogeneous Integration of Chiplet Designs TaiNEX2 - 701 F

1:00pm PDT

AI-Driven Multiphysics Analysis for Silicon-to-System Advanced Packaging TaiNEX2 - 701 F

1:15pm PDT

AMD Advanced Packaging - Past, Present, and Future TaiNEX2 - 701 F

1:45pm PDT

From Edge to Cloud: Custom ASIC Unleashing Datacenter AI Innovation TaiNEX2 - 701 F

2:15pm PDT

Chiplets Based HPC And AI Product Test Challenges TaiNEX2 - 701 F

2:45pm PDT

Lifecycle System Monitoring with Arm’s System Monitoring Control Framework (SMCF) and proteanTecs TaiNEX2 - 701 F

3:15pm PDT

Panel: Chiplet Technology in the AI Era: Opportunities and Challenges TaiNEX2 - 701 F

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