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2025 OCP APAC Summit
Venue: TaiNEX2 - 701 G clear filter
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Tuesday, August 5
 

1:00pm PDT

Opening Track Overview / APAC Based Project TaiNEX2 - 701 G

1:40pm PDT

Use Cases for CXL RAS Firmware-First Error Handling TaiNEX2 - 701 G

2:20pm PDT

Architecting AI Storage: A Strategy for High-Performance and Tenant Object Storage TaiNEX2 - 701 G

2:40pm PDT

Optimizing I/O for AI Workloads and Boosting Checkpointing with FDP TaiNEX2 - 701 G

3:15pm PDT

NVMe TaiNEX2 - 701 G

4:15pm PDT

Unlocking Next-Generation Data Center Performance: Leveraging CXL Memory for Scalable AI and Database Workloads TaiNEX2 - 701 G

4:35pm PDT

Cooling Presentation TaiNEX2 - 701 G
 
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Tuesday, August 5
Wednesday, August 6
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TaiNEX2 - 703
Taipei Nangang Exhibition Center Hall 2
  • AI Clusters
  • Chiplets & Advanced Packaging / Photonics
  • Cooling Environments
  • Future Technologies Symposium
  • Keynotes
  • Meals
  • Networking
  • Optical Communication Networks
  • Rack & Power
  • Server
  • Storage