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2025 OCP APAC Summit
2025 OCP APAC Summit
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Venue:
TaiNEX2 - 703
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Tuesday
, August 5
2:35pm
PDT
Fast and Accurate Heat Dispersion Modeling for Data Centers
TaiNEX2 - 703
3:15pm
PDT
Advancements in 400G/Lane SerDes for High-Speed AI Connectivity
TaiNEX2 - 703
3:40pm
PDT
Pioneering AI Cooling: High Power Cold Plates with 200W/cm² Heat Flux for Next-Gen AI ASICs
TaiNEX2 - 703
4:05pm
PDT
Thermal-Safe Operation for GPU Under Power Constraints Using Reinforcement Learning
TaiNEX2 - 703
4:30pm
PDT
Tensor Contraction as a First-Class Primitive: Learnings from Building Efficient and Programmable AI Compute
TaiNEX2 - 703
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Aug 5
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6, 2025
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TaiNEX 2 - 701 CD
TaiNEX 2 - 701 E
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TaiNEX2 - 703
Taipei Nangang Exhibition Center Hall 2
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Tuesday
, August 5
Wednesday
, August 6
Venue
TaiNEX 2 - 701 CD
TaiNEX 2 - 701 E
TaiNEX2 - 701 F
TaiNEX2 - 701 G
TaiNEX2 - 701 H
TaiNEX2 - 703
Taipei Nangang Exhibition Center Hall 2
Session Type
AI Clusters
Chiplets & Advanced Packaging / Photonics
Cooling Environments
Future Technologies Symposium
Keynotes
Meals
All
Break
Lunch
Welcome Reception
Networking
Optical Communication Networks
Rack & Power
Server
Storage
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