2025 OCP APAC Summit: Grid

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TaiNEX 2 - 701 CD	TaiNEX 2 - 701 E	TaiNEX2 - 701 F	TaiNEX2 - 701 G	TaiNEX2 - 703	Taipei Nangang Exhibition Center Hall 2

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Keynotes 9:00am - 11:30am

Introduction of IO...

Introduction to OC...

Enhancing Financia...

World first intern...

APN-T 400G Muxpond...

Operational challe...

Tenant Aware VM an...

Remote GPU over AP...

Ideal AI/ML optica...

KV Cache Sharing o...

Towards Energy-Eff...

Optical circuit sw...

Reference Implemen...

State of the Debat...

Architecting the A...

Revisit RoCEv2 iss...

Evolving FBOSS to...

New paradigm for l...

Dynamic ECN Thresh...

e-Tube Technology...

End-to-End Observability Across... 3:15pm - 3:45pm

Proactive Link Man...

Adaptive Multi-Ten...

Scale-up AI Networking Alternatives -... 4:25pm - 5:00pm

Opening Track Over...

Use Cases for CXL...

Architecting AI St...

NVMe

OCP Composable Sec...

Unlocking Next-Gen...

Cooling Presentati...

Fast and Accurate Heat Dispersion Modeling for D...

Advancements in 400G/Lane SerDes for High-Speed...

Pioneering AI Cooling: High Power Cold Plates wi...

Thermal-Safe Operation for GPU Under Power Const...

Tensor Contraction as a First-Class Primitive: L...

Lunch Sponsored by ASE 12:00pm - 1:00pm

Break

Welcome Reception Sponsored by Meta 5:00pm - 6:30pm

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TaiNEX 2 - 701 E	TaiNEX2 - 701 F	TaiNEX2 - 701 G	TaiNEX2 - 701 H	TaiNEX2 - 703	Taipei Nangang Exhibition Center Hall 2

8:45am
9:00am
9:15am
9:30am
9:45am
10:00am
10:15am
10:30am
10:45am
11:00am
11:15am
11:30am
11:45am
12:00pm
12:15pm
12:30pm
12:45pm
1:00pm
1:15pm
1:30pm
1:45pm
2:00pm
2:15pm
2:30pm
2:45pm
3:00pm
3:15pm
3:30pm
3:45pm
4:00pm

OCP Open Systems f...

Exploring Azure's...

Catalina- Meta's L...

AI Computing Desig...

Role of Ethernet i...

High LLM Density f...

Elastic Management...

AI Application Con...

Technical Deep Div...

UALink Overview

Scale Up Ethernet...

Panel: Scale-up Ecosystem Discus... 2:00pm - 2:30pm

Cooling Solutions...

Liquid Cooling Sol...

Innovative Liquid-...

Advancing the AI F...

Open Chiplet Economy: Bridging T... 9:00am - 9:30am

Meeting AI Workloa...

Innovations with P...

Integrated Photoni...

Introduction to Co...

Extending the Fron...

AI-Driven Multiphy...

AMD Advanced Packa...

From Edge to Cloud...

Chiplets Based HPC...

Lifecycle System M...

Panel: Chiplet Technology in the AI Era: Opportunities and Chall... 3:00pm - 4:00pm

Introduction and O...

Empowering the AI...

Liteon Powering th...

Requirements/Consi...

Electromechanical...

Zero-Bias TLVR Exp...

Rack-Level Power Systems 11:30am - 12:00pm

Introduction and O...

Beyond ORv3 HPR Bu...

Optimizing Bus Bar...

Tray-Level 48V Two...

Rack Architecture...

ORV3 rack Ship-loa...

ORV3 essential acc...

Cooling Environmen...

Super Fluid Techno...

Superfluid Technol...

Empowering Data Ce...

Chip to Data Therm...

Intel Super Fluid...

Advanced Liquid Co...

Energy Efficiency...

Exhausted Heat Reu...

Waste Heat Recover...

Embracing AI: Infr...

UQDv2 - Enabling L...

Comprehensive Anal...

Enabling Scalable,...

The Cooling Soluti...

The Evolution of D...

CDU

Overview of safety...

Data Center Commis...

Corrosion Behavior...

Making the case fo...

Predicting immersi...

Advancing Data Cen...

Architecting Open-...

Low Carbon Emissio...

Super Computing an...

Accelerating AI fr...

Trending on Next G...

Advancing Data Cen...

Advancing Edge-MHS...

Thermal Design Con...

OCP Modularity Sta...

Advanced Server Ma...

APEC (Advanced PCI...

Strategic Innovati...

Deployment of an O...

Scaling the Next W...

Break

Lunch Sponsored by ASE 12:00pm - 1:00pm

Break